TEXT-Ceva expands partnership with Infineon

(The following was issued by Israel’s Ceva Inc (CEVA.O: )):

June 7 – CEVA Inc [(Nasdaq: CEVA); (LSE: CVA)], the leading
licensor of silicon intellectual property (SIP) platform
solutions and DSP cores, and Infineon Technologies today
announced the companies have extended their long-term strategic
relationship to include the dual MAC, 32-bit CEVA-TeakLite-III
DSP core for the future mobile phone and modem platform
solutions from Infineon.
(Logo: http://photos.prnewswire.com/prnh/20051010/CEVALOGO)

This latest agreement enables Infineon to leverage the
superior features and processing performance offered by the
latest generation CEVA-TeakLite-III DSP architecture while
maintaining code compatibility with the existing CEVA-based
Infineon architectures.

The CEVA-TeakLite-III delivers industry-leading DSP
performance required for advanced modem, voice and audio
processing while maintaining low power and small die size.

“DSP plays an essential role in overall power consumption
and performance in handsets and the CEVA-TeakLite-III DSP brings
to Infineon the capability to dramatically improve future
wireless and multimedia processor designs,” said Gideon
Wertheizer, CEO of CEVA.

“We look forward to continuing our long standing partnership
with Infineon to advance their leadership in mobile phone and
modem platforms.”

CEVA’s industry-leading DSP cores power many of the world’s
leading handsets today, with all top five handset OEMs shipping
CEVA-powered phones.

To date, more than 700 million CEVA-powered handsets have
shipped worldwide spanning the entire value chain, from
ultra-low cost devices through to smartphones.

Addressing next-generation 4G terminal and infrastructure
markets, CEVA’s latest generation DSPs have been specifically
architected to overcome the stringent power consumption,
time-to-market and cost constraints associated with developing
high-performance multimode 2G/3G/4G solutions.

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TEXT-Ceva expands partnership with Infineon